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INTEGRATED CIRCUITS
DATA SHEET
SAA5700 Chinese Character System Teletext (CCST) decoder
Preliminary specification File under Integrated Circuits, IC02 1997 May 16
Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
FEATURES * Acquisition and display of the 625-line PAL CCST Chinese standard for teletext, with Chinese and Latin character sets * Supports multiple DRAM sizes: 256K x 4 bits, 1M x 4 bits, 4M x 4 bits and 2 x 1M x 4 bits with an additional decoder/demultiplexer IC * Acquires and stores in background up to (typically) 400 pages with 1M x 4 bits external DRAM * CCST Fastext, with capability of displaying Chinese characters on Fastext prompt row * Meshing for reduced contrast video background in subtitles and boxes * Full line and screen colour to all edges of screen * Supports 625-line 50/100 Hz display modes * Scan-locked and stand-alone sync modes; supports video-locked sync modes with external PLL * Easy control via high level I2C-bus SAFARI commands * Sync mode switching and picture centring via I2C-bus SAFARI commands * Supports external decryption unit for encrypted data. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA5700GP QFP64 DESCRIPTION plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SAA5700
GENERAL DESCRIPTION The SAA5700 is a Chinese teletext decoder suitable for TV and multimedia applications. It incorporates all the data slicing, acquisition and display circuitry on-chip, as well as the logic for memory management. An external DRAM is used to store the currently displayed page and also the precaptured teletext pages. An external ROM is used to store the ideographic Chinese character set. There is a high level software interface with easy commands for the control of the decoder. Control is achieved via the I2C-bus. The device is available in a QFP64 package.
VERSION SOT319-2
1997 May 16
2
Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
BLOCK DIAGRAM
SAA5700
handbook, full pagewidth
VDDD1 VSS1 VDDD2 VSS2 VSS3 VDDX VSSO VDDA VSSA 35 33 48 49 2 19 20 9 8
VSS 14,16, 26
BLACK
4 SYNC SEPARATOR 5
FRONT END
ACQUISITION TIMING
CVBS
REF+ STN IREF
10 6 7
DATA ACQUISITION
1 12 MHz OSCILLATOR AND CLOCK GENERATOR 6 MHz 64
OSCOUT OSCIN
59 63 PACKET BUFFER 60 PROCESSOR BLOCK 61 62
RESET
DCL DDA SCL SDA
BUS 27 42 53 44 54, 41, 40, 38 to 36, 32 to 28 RA10 to RA0 55 to 58, 52, 51, 47, 46 RD7 to RD0 MEMORY INTERFACE DISPLAY INTERFACE
24 MHz
ROMCS RAS CAS WE
21 22 23 24
R G B BLAN
17 DISPLAY TIMING 18 25
LFB FFB/STTV ODD/EVEN
SAA5700
DISPLAY SECTION
MGG539
Fig.1 Block diagram.
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
PINNING SYMBOL OSCOUT VSS3 n.c. BLACK CVBS STN IREF VSSA VDDA REF+ i.c. i.c. i.c. VSS n.c. VSS LFB FFB/STTV VDDX VSSO R G B BLAN ODD/EVEN VSS ROMCS RA0 RA1 RA2 RA3 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 I/O O ground - I/O I I/O I ground supply I - - - ground - ground I I/O supply ground O O O O O ground O O O O O oscillator output to crystal DESCRIPTION
SAA5700
ground for I/O pad buffers connect to VSS; internally connected to VSS1 and VSS2 not connected black level sample and hold capacitor; 100 nF to VSSA video signal input; 100 nF series capacitor, 250 source impedance maximum, reference to VSSA ADC current reference decoupling; 100 nF to VSSA current reference input; 10 k to VSSA 0 V power supply; analog +5 V power supply; analog ADC voltage reference decoupling; 100 nF to VSSA internally connected; do not use internally connected; do not use internally connected; do not use connect to VSS for normal use not connected connect to VSS for normal use scan line flyback input (HSYNC) scan field flyback input (VSYNC)/sync to TV output +5 V power supply; connect to VDD for normal use output stage current return and 0 V analog Red output analog Green output analog Blue output fast blanking (VDS) frame rate signal for hardware de-interlace (FRAME) connect to VSS for normal use chip select (address decode) for ROM bit 0 of address to DRAM, ROM and IC bit 1 of address to DRAM, ROM and IC bit 2 of address to DRAM, ROM and IC bit 3 of address to DRAM, ROM and IC
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SYMBOL RA4 VSS1 n.c. VDDD1 RA5 RA6 RA7 n.c. RA8 RA9 RAS n.c. WE i.c. RD0 RD1 VDDD2 VSS2 n.c. RD2 RD3 CAS RA10 RD7 RD6 RD5 RD4 RESET DDA SCL SDA DCL OSCIN PIN 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 I/O O ground - supply O O O - O O O - O - I/O I/O supply ground - I/O I/O O O I/O I/O I/O I/O I I/O I I/O O I DESCRIPTION bit 4 of address to DRAM, ROM and IC 0 V power supply digital; connected internally to VSS2 and VSS3 not connected +5 V power supply digital; connected internally to VDD2 bit 5 of address to DRAM, ROM and IC bit 6 of address to DRAM, ROM and IC bit 7 of address to DRAM, ROM and IC not connected bit 8 of address to DRAM, ROM and IC bit 9 of address to DRAM, ROM and IC row address strobe to DRAM; active LOW not connected write enable to DRAM and IC; active LOW internally connected; do not use bit 0 of data bus to/from DRAM, ROM and IC bit 1 of data bus to/from DRAM, ROM and IC +5 V power supply digital; connected internally to VDD1 0 V power supply digital; connected internally to VSS1 and VSS3 not connected bit 2 of data bus to/from DRAM, ROM and IC bit 3 of data bus to/from DRAM, ROM and IC column address strobe to DRAM; active LOW bit 10 of address to DRAM, ROM and IC bit 7 of data bus to/from DRAM, ROM and IC bit 6 of data bus to/from DRAM, ROM and IC bit 5 of data bus to/from DRAM, ROM and IC bit 4 of data bus to/from DRAM, ROM and IC chip/processor reset input (active HIGH) bidirectional serial data to/from optional Decryptor primary I2C-bus serial clock input primary I2C-bus serial data serial clock to optional Decryptor oscillator input from crystal/external clock input
SAA5700
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SAA5700
54 RA10
handbook, full pagewidth
59 RESET
64 OSCIN
60 DDA
62 SDA
53 CAS
57 RD5
56 RD6
52 RD3 51 50 49 48 47 46 45 44 43
63 DCL
OSCOUT VSS3 n.c. BLACK CVBS STN IREF VSSA VDDA REF+ i.c. i.c. i.c. VSS n.c. VSS LFB FFB/STTV VDDX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 VSSO 20 R 21 G 22 B 23 BLAN 24 ODD/EVEN 25 VSS 26 ROMCS 27 RA0 28 RA1 29 RA2 30 RA3 31 RA4 32
55 RD7
58 RD4
61 SCL
RD2 n.c. VSS2 VDDD2 RD1 RD0 i.c. WE n.c. RAS RA9 RA8 n.c. RA7 RA6 RA5 VDDD1 n.c. VSS1
SAA5700
42 41 40 39 38 37 36 35 34 33
MGG538
Fig.2 Pin configuration.
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
HIGH LEVEL I2C-BUS COMMAND INTERFACE
SAA5700
This device communicates via the I2C-bus using the SAFARI protocol. The following section indicates the protocol which is supported by this decoder. User commands Table 1 lists the CCST user command codes in TV mode; Table 2 lists the CCST user command codes in Text mode. Table 1 TV mode user command codes FUNCTION - - - PICTURE STATUS - - TIME - - - - - - - - TV PROGRAMME 0 TV PROGRAMME 1 TV PROGRAMME 2 TV PROGRAMME 3 TV PROGRAMME 4 TV PROGRAMME 5 TV PROGRAMME 6 TV PROGRAMME 7 TV PROGRAMME 8 TV PROGRAMME 9 TV PROGRAMME 10 TV PROGRAMME 11 TV PROGRAMME 12 TV PROGRAMME 13 TV PROGRAMME 14 TV PROGRAMME 15 Table 2 Text mode user command codes FUNCTION RED GREEN YELLOW SUBTITLE STATUS HOLD TOGGLE REVEAL CANCEL TOGGLE INDEX - BROWSE REVEAL SET TOGGLE - PREVIOUS DISPLAY CHINESE PROMPT SUBCODE TOGGLE 1 2 3 4 5 6 7 8 9 0 SIZE UP DOWN CYAN MIX TEXT
FUNCTION ID (HEX) 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F
FUNCTION ID (HEX) 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 27 28 29 3A 3B 3C 3D 3E 3F
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
Extended commands The extended commands for the decoder are listed in Table 3. Table 3 Extended commands OBJECT NAME Display ID (HEX) 48 FUNCTION NAME set sync mode set display position Processor Memory and OSD 52 53 restart software read packet ID (HEX) 04 08 06 03 PARAMETER LENGTH (BYTES) INPUT 1 4 3 1 [+1] 1 +40 0 0 0 0 OUTPUT - - - 40
SAA5700
PARAMETERS INPUT sync mode OUTPUT none
row start, line start none FFFFFCH packet number, [Designation code] packet number, packet data none none none none none packet data
write packet OSD mode on OSD mode off OSD display clear display page
06 08 0A 0E 10
- - - - -
none none none none none
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDD1 VDDD2 VDDA VDDX VI(max) VO(max) VDDX-DDn II(d) IO(d) IO(max) Tstg Tamb PARAMETER digital supply voltage 1 digital supply voltage 2 analog supply voltage supply voltage X maximum input voltage (any input) maximum output voltage (any output) supply voltage difference between VDDX, VDDD1, VDDD2 and VDDA diode input current (DC) diode output current (DC) maximum output current (any output) storage temperature operating ambient temperature - - - - -55 -20 0.25 20 20 10 +125 +70 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 MIN. MAX. +6.5 +6.5 +6.5 +6.5 VDD + 0.5 VDD + 0.5
SAA5700
UNITS V V V V V V V mA mA mA C C
CHARACTERISTICS Tamb = -20 to +70 C and VDDn = 4.5 to 5.5 V; unless otherwise indicated. SYMBOL Power supplies VDDD1 IDDD1 VDDD2 IDDD2 VDDA IDDA VDDX IDDX IDD(tot) Inputs CVBS Vsync Vbur(p-p) VI(video)(p-p) VI(data) Zsource VSW(I) Ci 1997 May 16 sync amplitude colour burst amplitude (peak-to-peak value) video input amplitude (peak-to-peak value) teletext data amplitude source impedance input switching level of sync separator input capacitance 9 0.1 0 0.7 0.29 - 1.6 - 0.3 0.3 1.0 0.46 - 1.9 - 0.6 4 1.4 0.71 250 2.2 10 V V V V V pF digital supply voltage 1 digital supply current 1 digital supply voltage 2 digital supply current 2 analog supply voltage analog supply current supply voltage X supply current X total supply current 4.5 - 4.5 - 4.5 - 4.5 - - 5.0 95 5.0 2.4 5.0 40 5.0 32 170 5.5 140 5.5 6.5 5.5 53 5.5 40 240 V mA V mA V mA V mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SYMBOL IREF RIREF VIREF RESET VIL VIH ILI VIL VIH Vhys ILI II(max) tW(LFB) ti(r) ti(f) VIL VIH ILI II(max) tW(FFB) ti(r) ti(f) LOW-level input voltage HIGH-level input voltage input leakage current VI = 0 to VDD -0.3 2.0 -10 -0.3 2.4 - VI = 0 to VDD note 1 -10 -1 200 - - -0.3 0.7VDD VI = 0 to VDD -10 -1 1 - - - - - - - 0.7 - - - - - 0.3VDD VDD + 0.5 +10 +1 - - - +0.8 resistor to VSSA voltage on IREF pin VDD = 5 V - - 10 2.3 - - PARAMETER CONDITIONS MIN. TYP.
SAA5700
MAX.
UNIT
k V
V V A V V V mA A ns ns ns
VDD + 0.5 +10
LFB (HSYNC) LOW-level input voltage HIGH-level input voltage input hysteresis voltage input leakage current maximum input current LFB input pulse width input rise time input fall time +0.6 VDD + 0.5 - +10 +1 - 100 100 - - - - - 500 500
FFB (VSYNC) LOW-level input voltage HIGH-level input voltage input leakage current maximum input current FFB input pulse width input rise time input fall time V V A mA display lines ns ns
Input/outputs REF+ CREF+ VREF+ Vosc(p-p) Ci fosc fosc BLACK CBLACK VBLACK storage capacitor to VSSA black level for nominal sync amplitude - 1.75 100 2.0 - 2.25 nF V decoupling capacitor to VSSA DC voltage on REF+ - 2.3 - - - - 100 2.5 - 2.7 - 10 - - nF V
OSCIN AND OSCOUT oscillation amplitude (peak-to-peak value) input capacitance oscillator frequency oscillator frequency tolerance VDD - 6.0 500 V pF MHz ppm
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SYMBOL ILI STN CSTN VSTN fSCL VIL VIH VOL ILI Ci CL ti(r) decoupling capacitor to VSSA DC voltage on STN - 0.95 100 1.1 - - - - - - - - - - - - - - 1.25 PARAMETER input leakage current CONDITIONS VI = 0 to VDD MIN. -10 - TYP.
SAA5700
MAX. +10
UNIT A nF V
SCL (OPEN-DRAIN) SCL clock frequency LOW-level input voltage HIGH-level input voltage LOW-level output voltage input leakage current input capacitance load capacitance input rise time fSCL = 100 kHz; note 2 fSCL = 400 kHz; note 2 ti(f) input fall time fSCL = 100 kHz; note 3 fSCL = 400 kHz; note 3 to(f) output fall time 3 to 1.5 V; IOL = 3 mA IOL = 3 mA IOL = 6 mA VI = 0 to VDD 0 -0.5 3.0 0 0 -10 - - 50 50 50 50 50 400 +1.5 VDD + 0.5 0.4 0.6 +10 10 400 1000 300 300 300 250 kHz V V V V A pF pF ns ns ns ns ns
SDA (OPEN-DRAIN) VIL VIH VOL ILI Ci CL ti(r) LOW-level input voltage HIGH-level input voltage LOW-level output voltage input leakage current input capacitance load capacitance input rise time fSCL = 100 kHz; note 2 fSCL = 400 kHz; note 2 ti(f) input fall time fSCL = 100 kHz; note 3 fSCL = 400 kHz; note 3 to(f) output fall time 3 to 1.5 V; IOL = 3 mA IOL = 3 mA IOL = 6 mA VI = 0 to VDD -0.5 3.0 0 0 -10 - - 50 50 50 50 50 - - - - - - - - - - - - +1.5 VDD + 0.5 0.4 0.6 +10 10 400 1000 300 300 300 250 V V V V A pF pF ns ns ns ns ns
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SYMBOL PARAMETER CONDITIONS MIN. -0.3 2.0 IOL = 1.6 mA VI = 0 to VDD 0 -10 - - 2.2 to 0.6 V; IOL = 1.6 mA - - - - - - - - TYP.
SAA5700
MAX.
UNIT
DCL AND DDA (INTERNAL PULL-DOWN RESISTOR) VIL VIH VOL ILI Ci CL to(f) RD7 TO RD0 VIL VIH VOL VOH ILI Ci CL to(r) to(f) Outputs CAS VOL VOH CL to(r) to(f) VOL VOH CL to(r) to(f) VOL VOH CL to(r) to(f) LOW-level output voltage HIGH-level output voltage load capacitance output rise time into CL output fall time into CL LOW-level output voltage HIGH-level output voltage load capacitance output rise time into CL output fall time into CL LOW-level output voltage HIGH-level output voltage load capacitance output rise time into CL output fall time into CL 0.6 to 2.2 V 2.2 to 0.6 V 0.6 to 2.2 V 2.2 to 0.6 V 0.6 to 2.2 V 2.2 to 0.6 V IOL = 1.6 mA IOH = -0.2 mA 0 2.4 - - - 0 2.4 - - - 0 2.4 - - - - - - - - - - - - - - - - - - 0.4 VDD 50 5 5 V V pF ns ns LOW-level input voltage HIGH-level input voltage LOW-level output voltage HIGH-level output voltage input leakage current input capacitance load capacitance output rise time into CL output fall time into CL 0.6 to 2.2 V 2.2 to 0.6 V IOL = 1.6 mA IOH = -0.2 mA VI = 0 to VDD -0.3 2.0 0 2.4 -10 - - - - - - - - - - - - - +0.8 VDD + 0.5 0.4 VDD +10 10 30 10 10 V V V V A pF pF ns ns LOW-level input voltage HIGH-level input voltage LOW-level output voltage input leakage current input capacitance load capacitance output fall time +0.8 VDD + 0.5 0.4 +10 10 50 10 V V V A pF pF ns
RAS, WE, ROMCS, RA10 TO RA0 IOL = 1.6 mA IOH = -0.2 mA 0.4 VDD 50 10 10 V V pF ns ns
ODD/EVEN (FRAME) IOL = 1.6 mA IOH = -0.2 mA 0.4 VDD 200 200 200 V V pF ns ns
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SYMBOL STTV VSTTV VSTTV(DC) IO(drive) R, G AND B IOL IOH RL CL to(r) to(f) BLAN (VDS) VOH VOL CL to(r) to(f) tSK Notes HIGH-level output voltage LOW-level output voltage load capacitance output rise time output fall time skew delay between outputs R,G,B and BLAN 10% to 90% 90% to 10% IOH = -2 mA IOL = 2 mA VDD - 0.25 - 0 - - - - - - - - - VDD 0.2 50 15 15 15 LOW-level output current (black level) HIGH-level output current (full intensity) load resistance to VSSO for nominal 1 V(p-p) output load capacitance output rise time output fall time 10% to 90% 90% to 10% VDDX = 5 V -10 5.1 - - - - - 6.0 160 - - - +10 6.9 - 20 15 15 VCS, TCS amplitude nominal DC voltage output drive 0.2 1.85 - 0.3 2.0 - 0.4 2.15 3 PARAMETER CONDITIONS MIN. TYP.
SAA5700
MAX.
UNIT
V V mA A mA pF ns ns
V V pF ns ns ns
1. This current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs. An external series resistor must be used to limit the input currents to 1 mA. 2. Measured from VIL(max) to VIH(min). 3. Measured from VIH(min) to VIL(max).
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
Table 4 I2C-bus Timing (see note 1 and Fig.3) 100 kHz SYMBOL fSCL tLOW tHIGH tSU;DAT tHD;DAT tSU;STO tBUF tHD;STA tSU;STA tr tf Note PARAMETER MIN. SCL clock frequency LOW period of the SCL clock HIGH period of the SCL clock data set-up time date hold time set-up time clock HIGH to STOP set-up time STOP to START START hold time set-up time clock rising edge to START rise time of both SDA and SCL signals fall time of both SDA and SCL signals 0 4.7 4.0 250 0 4.7 4.7 4.0 4.7 - - - - - - - - - - 1000 300 MAX. 100 0 1.3 0.6 100 0 0.6 1.3 0.6 0.6 - - MIN. - - - - - - - - 300 300 400 kHz
SAA5700
UNIT MAX. 400 kHz s s s s s s s s ns ns
1. The I2C-bus interface pins SDA and SCL may pull the data and clock lines below 3 V while the power supply VDD is in the range 0.4 to 0.8 V. Outside this range, the SDA and SCL pins behave correctly.
handbook, full pagewidth
tHIGH
tLOW
tr
tf
SCL tSU;STA tHD;STA SDA tBUF
MGG541
tSU;DAT tHD;DAT
tSU;STO
Fig.3 Primary I2C-bus timing.
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
DRAM Interface timing (see note 1 and Fig.4) SYMBOL Tcy(RAS) tpch(RAS) th(CAS) td(RAS-CAS) tWL(CAS) Tcy(CAS) tpch(CAS) th(CAS-RAS) tpch(CAS-RAS) tsu(RA) th(RA) tsu(CA) th(CA) tsu(R) th(R)(CAS) th(R)(RAS) tsu(W) th(W) tsu(i)(D) th(i)(D) tACC(R)(CAS) tACC(R)(RAS) Note 1. Based on a display clock frequency of 24 MHz, maximum 24 MHz + 500 ppm. RAS cycle time RAS precharge time CAS hold time RAS to CAS delay time CAS pulse width LOW CAS page mode cycle time CAS precharge time RAS hold time after CAS CAS to RAS precharge time row address set-up time row address hold time column address set-up time column address hold time read command set-up time read command hold time from (CAS) read command hold time from (RAS) write command set-up time write command hold time data input set-up time data input hold time read access time from (CAS) read access time from (RAS) PARAMETER - 60 80 20 20 50 10 20 10 0 10 0 15 0 0 10 0 15 0 15 - - MIN. - - - - - - - - - - - - - - - - - - - - - TYP. 375 - - - - - - - - - - - - - - - - - - - - 20 80
SAA5700
MAX.
UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SAA5700
handbook, full pagewidth
tRP RAS
tCYC
tCSH tPC CAS
tRSH
tRCD tASR tRAH ADDRESS tASC
tCAS tCAH
tCP
tRCS WE READ CYCLE RD OUT tCAC
tRRH tRCH
tRAC tWCS WE
tWCH
WRITE CYCLE
tDH tDS RD IN
MGG542
Fig.4 DRAM interface timing.
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
APPLICATION INFORMATION
SAA5700
handbook, full pagewidth
+5 V 100 nF VDDD1 OSCIN 35 64
0V
+5 V
100 nF VSS1 33 VDDX 19 63 DCL +5 V 0V
6 MHz 100 k crystal oscillator 22 pF OSCOUT 22 pF VSS3 1
60 DDA VDDD2 VSS2 WE CAS RAS RD3 to RD0 8 52, 51, 47, 46 28 to 32, RA0 to RA10 36 to 38, 40,41,54
100 nF VDD VSS WE CAS RAS D3 to D0 DRAM
48 2 49 44
100 nF 75
CVBS
5
53 42
CVBS
VSSA 10 k front end 100 nF 100 nF 100 nF 100 nF +5 V HSYNC VSYNC TV display R/G/B/BLAN RGB ground IREF STN REF+ BLACK VDDA
A10 to A0
7 6
OE 0V
SAA5700
10 4 55 to 58 A18 to A0 17 OE CE +5 V 0V ROM 0V RD7 to RD4 D3 to D0 D7 to D4 +5 V
9
LFB FFB
18 R/G/B/BLAN 21 to 24 VSSO 20 ODD/EVEN
DI
DO VDD VSS EN
74LS573 ODD/EVEN 25 OE
0V
I2C-bus to microcontroller
SDA SCL
62 61 59 27 14 16 26 RESET VSS VSS VSS ROMCS
MGG540
RESET
Fig.5 Application Diagram.
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
PACKAGE OUTLINE QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SAA5700
SOT319-2
c
y X
51 52
33 32 ZE
A
e E HE A A2 A1
Q (A 3) Lp L detail X
pin 1 index
wM bp
64 1 wM D HD ZD 19
20
e
bp
vMA B vM B
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 3.20 A1 0.25 0.05 A2 2.90 2.65 A3 0.25 bp 0.50 0.35 c 0.25 0.14 D (1) 20.1 19.9 E (1) 14.1 13.9 e 1 HD 24.2 23.6 HE 18.2 17.6 L 1.95 Lp 1.0 0.6 Q 1.4 1.2 v 0.2 w 0.2 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT319-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
SAA5700
Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 May 16
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Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA5700
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1997 May 16
20
Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
NOTES
SAA5700
1997 May 16
21
Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
NOTES
SAA5700
1997 May 16
22
Philips Semiconductors
Preliminary specification
Chinese Character System Teletext (CCST) decoder
NOTES
SAA5700
1997 May 16
23
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/50/01/pp24
Date of release: 1997 May 16
Document order number:
9397 750 01008

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